Welcome to Tea with DidiDec 11, 2019
Only with the progress of the design of electronic components and printed circuit boards and the manufacturing process required to reduce the size, increase the density of components and increase the speed of signals can these technical products today and tomorrow be possible to achieve, while maintaining high returns and competitive costs.
The etching method for producing an HDI PCB and the MSAP process as a method to enhance the capability of the hdi pcb is discussed.
Traditionally, hdi pcb circuit formation is printed using subtraction-and-Etching processing.
The simplest form of this process is from the outer foil layer of about 12 to 18 [micro]
The thickness of a laser or mechanical drill into a blind hole.
Then, by plasma or chemical scale removal or a combination of the two, remove the panels to clean any resin residue on the target plate and assign some terrain to the via Wall to adhere to subsequent deposits.
The panel is then treated through major metalizing processes such as chemical copper, carbon-based direct metalization or conductive polymer to make the via Wall initially conductive, followed by flash plating of 2-4 micro].
After Flash plating using electrolytic copper, process the panel by filling electrolytic copper in panel plating mode.
Copper is chemically formulated by filling the solution, which can make full use of copper while minimizing the accumulation of copper on the surface.
At this step, it is usually 20 [micro]
3 Existing [m surface copper added]micro]
Flash copper m and 18 [:micro]M of copper foil.
The plating panel is then stretched and etched with a dry film to form a circuit pattern.
Bare copper (~40[micro]m)
Chemical reactions are defined using traditional copper chloride etchaway.
Then, print using traditional materials and lamination processes and subtraction.
Etching processing is limited in terms of the minimum line width and spacing, as the etching solution tends to be etched equally in all directions.
This leads to traces of the ladder profile that, as the width of the line decreases, are detrimental to product performance.
Definition with controlled impedance and consistent line profile are critical in fine measurement.
Etching treatment is usually limited to the width and spacing of about 60 to 100 [micro]
M, allows a single tracking route with pad spacing of 0. 5mm.
The further reduction of electronic equipment and the increase of functions continue to promote the progress of traditional printingand-
Etchprocessing extends the life of this process technology and extends it to finer lines, spacing, and smaller structures.
From these advances, processing technologies
Printing and etching and advanced tent processing (ATP).
The contributing factors of these processes include improved laser drilling equipment, reduced copper thickness laminate, copper surface treatment before laser drilling, and copper plating process for filling.
Improvement of C [O. sub. 2]
Moreover, the UV laser can achieve higher continuous drilling.
Smaller size mass blind micro-pores, improved by Wall shape, will not cause lestarget pad damage even in the presence of glass straps, target pad remains less.
High-quality copper foil with reduced thickness will eventually reduce the copper etching burden during circuit formation.
The development of copper surface treatment chemistry before laser drilling improves the consistency of laser energy absorption in order to be more predictable and higher-Quality drilling.
Filling electrolytic copper plating provides a faster and more efficient process by filling, while minimizing the accumulation of copper on the surface, once again reducing the burden of finalcopper etching.
Finally, vertical continuous plating (VCP)
Compared with the lifting system, the equipment significantly improves the consistency and thickness distribution of the copper plating process.
Etching and ATP are very similar to the traditional subtraction processing.
Several important differences between these processes and traditional subtraction printing.
Etchprocess helps reduce line width and spacing.
Plating is not used for any layer and ATPprocessing-holes.
The connection between the layer and the layer is achieved by stacking or staggered micro-channels.
This eliminates the typical requirement of 25 [micro]
The m minimum value of copper plating through the center-
Holes, which may result in the need for 30 [micro]
Copper m on the surface of the panel to meet the specifications.